Electronic device, method, and non-transitory computer readable storage medium for managing transmissions to external electronic devices in wireless environment

ABSTRACT

An electronic device is provided. The electronic device includes a communication circuitry for Bluetooth low energy (BLE), and a processor. The processor is configured to obtain a connected isochronous group (CIG) event including a first connected isochronous stream (CIS) event that includes first sub-events and a second CIS event that includes second sub-events that at least partially overlap at least part of the first sub-events, and transmit, based on receiving an acknowledgement (ACK) signal for first data transmitted to a first external electronic device via a first sub-event among the first sub-events, second data to a second external electronic device via a third sub-event among the second sub-events, wherein the third sub-event overlaps a second sub-event immediately after the first sub-event among the first sub-events.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application, claiming priority under§ 365(c), of an International application No. PCT/KR2022/011707, filedon Aug. 5, 2022, which is based on and claims the benefit of a Koreanpatent application number 10-2021-0120056, filed on Sep. 8, 2021, in theKorean Intellectual Property Office, of a Korean patent applicationnumber 10-2021-0129314, filed on Sep. 29, 2021, in the KoreanIntellectual Property Office, and of a Korean patent application number10-2022-0064536, filed on May 26, 2022, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated byreference herein in its entirety.

BACKGROUND 1. Technical Field

The disclosure relates to an electronic device, a method, and anon-transitory computer readable storage media for managingtransmissions to external electronic devices within wirelessenvironments.

2. Description of Related Art

Compared to legacy Bluetooth™ (or classic Bluetooth), Bluetooth™ lowenergy (BLE) may provide reduced power consumption and provide at leasta similar or often greater communication range between connecteddevices. The BLE may be provided on an industrial, scientific, andmedical (ISM) radio band.

SUMMARY

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a communication circuitry forBluetooth low energy (BLE), and a processor operatively coupled with thecommunication circuitry, the processor being configured to obtain aconnected isochronous group (CIG) event including a first connectedisochronous stream (CIS) event that includes first sub-events, and asecond CIS event that includes second sub-events that at least partiallyoverlap at least part of the first sub-events, and transmit, based onreceiving an acknowledgement (ACK) signal for first data transmitted toa first external electronic device via a first sub-event among the firstsub-events, second data to a second external electronic device via athird sub-event among the second sub-events, wherein the third sub-eventoverlaps a second sub-event immediately after the first sub-event amongthe first sub-events.

In accordance with another aspect of the disclosure, a method foroperating an electronic device with a communication circuitry forBluetooth low energy (BLE) is provided. The method includes obtaining aconnected isochronous group (CIG) event including a first connectedisochronous stream (CIS) event that includes first sub-events and asecond CIS event that includes second sub-events that at least partiallyoverlap at least part of the first sub-events, and transmitting, basedon receiving an acknowledgement (ACK) signal for first data transmittedto a first external electronic device via a first sub-event among thefirst sub-events, second data to a second external electronic device viaa third sub-event among the second sub-events, wherein the thirdsub-event overlaps a second sub-event immediately after the firstsub-event among the first sub-events.

In accordance with another aspect of the disclosure, a non-transitorycomputer-readable storage medium is provided. The non-transitorycomputer-readable storage medium includes store one or more programscomprising instructions that, when executed by at least one processor ofan electronic device with a communication circuitry for a BLE, cause theelectronic device to obtain a connected isochronous group (CIG) eventthat includes a first connected isochronous stream (CIS) event includingfirst sub-events and a second CIS event including second sub-events atleast partially overlapping at least part of the first sub-events, basedon receiving an acknowledgement (ACK) signal on first data transmittedto a first external electronic device via a first sub-event among thefirst sub-events, transmit second data to a second external electronicdevice via a third sub-event among the second sub-events overlapping asecond sub-event immediately after the first sub-event among the firstsub-events.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes communicationcircuitry for Bluetooth low energy (BLE), and a processor operativelycoupled with the communication circuitry. The processor is configured totransmit, to a first external electronic device, a first packet that isa last packet from at least one target packet allocated for transmittingto the first external electronic device within a first connectedisochronous stream (CIS) event in a connected isochronous group (CIG)event, via a second sub-event before a first sub-event ending the firstCIS event, transmit, in response to receiving an acknowledgement (ACK)signal for the first packet via the second sub-event from the firstexternal electronic device, a second packet to a second externalelectronic device via a sub-event among sub-events in a second CIS eventin the CIG event, and re-transmit, in response to receiving anon-acknowledgement (NACK) signal for the first packet via the secondsub-event from the first external electronic device, the first packet tothe first external electronic device via a sub-event immediately afterthe second sub-event among remaining sub-events in the first CIS event.

In accordance with another aspect of the disclosure, a method foroperating an electronic device with a communication circuitry forBluetooth low energy (BLE) is provided. The method includestransmitting, to a first external electronic device, a first packet thatis a last packet from at least one target packet allocated fortransmitting to the first external electronic device within a firstconnected isochronous stream (CIS) event in a connected isochronousgroup (CIG) event, via a second sub-event before a first sub-eventending the first CIS event, transmitting, in response to receiving anacknowledgement (ACK) signal for the first packet via the secondsub-event from the first external electronic device, a second packet toa second external electronic device via a sub-event among sub-events ina second CIS event in the CIG event, and re-transmitting, in response toreceiving a non-acknowledgement (NACK) signal for the first packet viathe second sub-event from the first external electronic device, thefirst packet to the first external electronic device via a sub-eventimmediately after the second sub-event among remaining sub-events in thefirst CIS event.

In accordance with another aspect of the disclosure, a non-transitorycomputer-readable storage medium is provided. The non-transitorycomputer-readable storage medium stores one or more programs comprisinginstructions that, when executed by at least one processor of anelectronic device with a communication circuitry for a BLE, cause theelectronic device to transmit, to a first external electronic device, afirst packet that is a last packet from at least one target packetallocated for transmitting to the first external electronic devicewithin a first connected isochronous stream (CIS) event in a connectedisochronous group (CIG) event, via a second sub-event before a firstsub-event ending the first CIS event, transmit, in response to receivingan acknowledgement (ACK) signal for the first packet via the secondsub-event from the first external electronic device, a second packet toa second external electronic device via a sub-event among sub-events ina second CIS event in the CIG event, and re-transmit, in response toreceiving a non-acknowledgement (NACK) signal for the first packet viathe second sub-event from the first external electronic device, thefirst packet to the first external electronic device via a sub-eventimmediately after the second sub-event among remaining sub-events in thefirst CIS event.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to an embodiment of the disclosure;

FIG. 2 illustrates an example of a wireless environment including anelectronic device according to an embodiment of the disclosure;

FIG. 3 is a simplified block diagram of an electronic device accordingto an embodiment of the disclosure;

FIG. 4A is a timing diagram illustrating a connected isochronous group(CIG) event having sequential arrangements;

FIG. 4B is a timing diagram illustrating a CIG event having aninterleaved arrangement;

FIGS. 5A, 5B, and 5C are timing diagrams illustrating a CIG event havinga hybrid arrangement according to various embodiments of the disclosure;

FIG. 6 is a timing diagram illustrating an anchor point of a CIG eventhaving a hybrid arrangement according to an embodiment of thedisclosure;

FIG. 7A illustrates methods of transmitting data through a CIG eventhaving a hybrid arrangement according to an embodiment of thedisclosure;

FIG. 7B illustrates an example of transmitting data through a CIG eventbased on identification of a designated event according to an embodimentof the disclosure;

FIG. 8 is a flowchart illustrating a method of transmitting data via aCIG event including a first CIS event and a second CIS event in a hybridarrangement according to an embodiment of the disclosure;

FIG. 9A is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in a hybridarrangement, based on synchronization of an anchor point of each of thefirst sub-events in the first CIS event and an anchor point of each ofthe second sub-events in the second CIS event, according to anembodiment of the disclosure;

FIG. 9B is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in a hybridarrangement, based on the length of each of the first sub-events in thefirst CIS event and the length of each of the second sub-events in thesecond CIS event, according to an embodiment of the disclosure;

FIG. 10 is a flowchart illustrating a method of transmitting data withina time interval in which at least part of the first CIS event overlapsat least part of the second CIS event, according to an embodiment of thedisclosure;

FIG. 11 is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in a hybridarrangement based on attributes of data, according to an embodiment ofthe disclosure;

FIG. 12 is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in a hybridarrangement, based on the quality of a link between the first externalelectronic device and the electronic device, according to an embodimentof the disclosure;

FIG. 13 is a flowchart illustrating a method of allocating an initialCIS event in a CIG event according to an embodiment of the disclosure;

FIG. 14 is a flowchart illustrating a method of allocating an initialCIS event in a CIG event, based on the quality of a first link between afirst external electronic device and an electronic device, and thequality of a second link between a second external electronic and anelectronic device, according to an embodiment of the disclosure; and

FIG. 15 is a flowchart illustrating a method of transmitting packets viaa CIG event with a hybrid arrangement according to an embodiment of thedisclosure.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding, but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purposes only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to an embodiment of the disclosure.

Referring to FIG. 1 , an electronic device 101 in a network environment100 may communicate with an electronic device 102 via a first network198 (e.g., a short-range wireless communication network), or at leastone of an electronic device 104 or a server 108 via a second network 199(e.g., a long-range wireless communication network). According to anembodiment of the disclosure, the electronic device 101 may communicatewith the electronic device 104 via the server 108. According to anembodiment of the disclosure, the electronic device 101 may include aprocessor 120, a memory 130, an input module 150, a sound output module155, a display module 160, an audio module 170, a sensor module 176, aninterface 177, a connecting terminal 178, a haptic module 179, a cameramodule 180, a power management module 188, a battery 189, acommunication module 190, a subscriber identification module (SIM) 196,or an antenna module 197. In some embodiments of the disclosure, atleast one of the components (e.g., the connecting terminal 178) may beomitted from the electronic device 101, or one or more other componentsmay be added in the electronic device 101. In some embodiments of thedisclosure, some of the components (e.g., the sensor module 176, thecamera module 180, or the antenna module 197) may be implemented as asingle component (e.g., the display module 160).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to one embodiment of the disclosure, as at least part of thedata processing or computation, the processor 120 may store a command ordata received from another component (e.g., the sensor module 176 or thecommunication module 190) in a volatile memory 132, process the commandor the data stored in the volatile memory 132, and store resulting datain a non-volatile memory 134. According to an embodiment of thedisclosure, the processor 120 may include a main processor 121 (e.g., acentral processing unit (CPU) or an application processor (AP)), or anauxiliary processor 123 (e.g., a graphics processing unit (GPU), aneural processing unit (NPU), an image signal processor (ISP), a sensorhub processor, or a communication processor (CP)) that is operableindependently from, or in conjunction with, the main processor 121. Forexample, when the electronic device 101 includes the main processor 121and the auxiliary processor 123, the auxiliary processor 123 may beadapted to consume less power than the main processor 121, or to bespecific to a specified function. The auxiliary processor 123 may beimplemented as separate from, or as part of the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display module 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment of the disclosure, the auxiliary processor 123 (e.g., animage signal processor or a communication processor) may be implementedas part of another component (e.g., the camera module 180 or thecommunication module 190) functionally related to the auxiliaryprocessor 123. According to an embodiment of the disclosure, theauxiliary processor 123 (e.g., the neural processing unit) may include ahardware structure specified for artificial intelligence modelprocessing. An artificial intelligence model may be generated by machinelearning. Such learning may be performed, e.g., by the electronic device101 where the artificial intelligence is performed or via a separateserver (e.g., the server 108). Learning algorithms may include, but arenot limited to, e.g., supervised learning, unsupervised learning,semi-supervised learning, or reinforcement learning. The artificialintelligence model may include a plurality of artificial neural networklayers. The artificial neural network may be a deep neural network(DNN), a convolutional neural network (CNN), a recurrent neural network(RNN), a restricted boltzmann machine (RBM), a deep belief network(DBN), a bidirectional recurrent deep neural network (BRDNN), deepQ-network or a combination of two or more thereof but is not limitedthereto. The artificial intelligence model may, additionally oralternatively, include a software structure other than the hardwarestructure.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input module 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputmodule 150 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 155 may output sound signals to the outside ofthe electronic device 101. The sound output module 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment of thedisclosure, the receiver may be implemented as separate from, or as partof the speaker.

The display module 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display module 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment of thedisclosure, the display module 160 may include a touch sensor adapted todetect a touch, or a pressure sensor adapted to measure the intensity offorce incurred by the touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment of the disclosure, the audiomodule 170 may obtain the sound via the input module 150, or output thesound via the sound output module 155 or a headphone of an externalelectronic device (e.g., an electronic device 102) directly (e.g.,wiredly) or wirelessly coupled with the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment of the disclosure, the sensormodule 176 may include, for example, a gesture sensor, a gyro sensor, anatmospheric pressure sensor, a magnetic sensor, an acceleration sensor,a grip sensor, a proximity sensor, a color sensor, an infrared (IR)sensor, a biometric sensor, a temperature sensor, a humidity sensor, oran illuminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment of the disclosure, the interface177 may include, for example, a high-definition multimedia interface(HDMI), a universal serial bus (USB) interface, a secure digital (SD)card interface, or an audio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment of the disclosure, the connecting terminal 178 may include,for example, a HDMI connector, a USB connector, a SD card connector, oran audio connector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment of the disclosure, the hapticmodule 179 may include, for example, a motor, a piezoelectric element,or an electric stimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment of the disclosure, the camera module 180 mayinclude one or more lenses, image sensors, image signal processors, orflashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to one embodiment of the disclosure,the power management module 188 may be implemented as at least part of,for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment of the disclosure, thebattery 189 may include, for example, a primary cell which is notrechargeable, a secondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment ofthe disclosure, the communication module 190 may include a wirelesscommunication module 192 (e.g., a cellular communication module, ashort-range wireless communication module, or a global navigationsatellite system (GNSS) communication module) or a wired communicationmodule 194 (e.g., a local area network (LAN) communication module or apower line communication (PLC) module). A corresponding one of thesecommunication modules may communicate with the external electronicdevice via the first network 198 (e.g., a short-range communicationnetwork, such as Bluetooth™, Wi-Fi direct, or infrared data association(IrDA)) or the second network 199 (e.g., a long-range communicationnetwork, such as a legacy cellular network, a 5^(th) generation (5G)network, a next-generation communication network, the Internet, or acomputer network (e.g., LAN or wide area network (WAN))). These varioustypes of communication modules may be implemented as a single component(e.g., a single chip), or may be implemented as multi components (e.g.,multi chips) separate from each other. The wireless communication module192 may identify and authenticate the electronic device 101 in acommunication network, such as the first network 198 or the secondnetwork 199, using subscriber information (e.g., international mobilesubscriber identity (IMSI)) stored in the subscriber identificationmodule 196.

The wireless communication module 192 may support a 5G network, after a4^(th) generation (4G) network, and next-generation communicationtechnology, e.g., new radio (NR) access technology. The NR accesstechnology may support enhanced mobile broadband (eMBB), massive machinetype communications (mMTC), or ultra-reliable and low-latencycommunications (URLLC). The wireless communication module 192 maysupport a high-frequency band (e.g., the mm Wave band) to address, e.g.,a high data transmission rate. The wireless communication module 192 maysupport various technologies for securing performance on ahigh-frequency band, such as, e.g., beamforming, massive multiple-inputand multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO),array antenna, analog beam-forming, or large-scale antenna. The wirelesscommunication module 192 may support various requirements specified inthe electronic device 101, an external electronic device (e.g., theelectronic device 104), or a network system (e.g., the second network199). According to an embodiment of the disclosure, the wirelesscommunication module 192 may support a peak data rate (e.g., 20 Gbps ormore) for implementing eMBB, loss coverage (e.g., 164 dB or less) forimplementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each ofdownlink (DL) and uplink (UL), or a round trip of 1 ms or less) forimplementing URLLC.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment of the disclosure, theantenna module 197 may include an antenna including a radiating elementincluding a conductive material or a conductive pattern formed in or ona substrate (e.g., a printed circuit board (PCB)). According to anembodiment of the disclosure, the antenna module 197 may include aplurality of antennas (e.g., array antennas). In such a case, at leastone antenna appropriate for a communication scheme used in thecommunication network, such as the first network 198 or the secondnetwork 199, may be selected, for example, by the communication module190 (e.g., the wireless communication module 192) from the plurality ofantennas. The signal or the power may then be transmitted or receivedbetween the communication module 190 and the external electronic devicevia the selected at least one antenna. According to an embodiment of thedisclosure, another component (e.g., a radio frequency integratedcircuit (RFIC)) other than the radiating element may be additionallyformed as part of the antenna module 197.

According to various embodiments of the disclosure, the antenna module197 may form a mmWave antenna module. According to an embodiment of thedisclosure, the mmWave antenna module may include a printed circuitboard, a RFIC disposed on a first surface (e.g., the bottom surface) ofthe printed circuit board, or adjacent to the first surface and capableof supporting a designated high-frequency band (e.g., the mmWave band),and a plurality of antennas (e.g., array antennas) disposed on a secondsurface (e.g., the top or a side surface) of the printed circuit board,or adjacent to the second surface and capable of transmitting orreceiving signals of the designated high-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment of the disclosure, commands or data may betransmitted or received between the electronic device 101 and theexternal electronic device 104 via the server 108 coupled with thesecond network 199. Each of the electronic devices 102 or 104 may be adevice of a same type as, or a different type, from the electronicdevice 101. According to an embodiment of the disclosure, all or some ofoperations to be executed at the electronic device 101 may be executedat one or more of the external electronic devices 102, 104, or 108. Forexample, if the electronic device 101 should perform a function or aservice automatically, or in response to a request from a user oranother device, the electronic device 101, instead of, or in additionto, executing the function or the service, may request the one or moreexternal electronic devices to perform at least part of the function orthe service. The one or more external electronic devices receiving therequest may perform the at least part of the function or the servicerequested, or an additional function or an additional service related tothe request, and transfer an outcome of the performing to the electronicdevice 101. The electronic device 101 may provide the outcome, with orwithout further processing of the outcome, as at least part of a replyto the request. To that end, a cloud computing, distributed computing,mobile edge computing (MEC), or client-server computing technology maybe used, for example. The electronic device 101 may provide ultralow-latency services using, e.g., distributed computing or mobile edgecomputing. In another embodiment of the disclosure, the externalelectronic device 104 may include an internet-of-things (IoT) device.The server 108 may be an intelligent server using machine learningand/or a neural network. According to an embodiment of the disclosure,the external electronic device 104 or the server 108 may be included inthe second network 199. The electronic device 101 may be applied tointelligent services (e.g., smart home, smart city, smart car, orhealthcare) based on 5G communication technology or IoT-relatedtechnology.

An electronic device, using an isochronous logical transport referred toas a connected isochronous stream (CIS), may transmit data (or packets)including information on multimedia contents to each of the externalelectronic devices through an isochronous link between each of theplurality of external electronic devices and the electronic device. Forexample, the CIS may be configured as a connected isochronous group(CIG) event including a plurality of CIS events.

Meanwhile, the quality of a link (e.g., CIS link) between each of theplurality of external electronic devices and the electronic device maychange depending on a change in a wireless environment including theelectronic device. For example, when the electronic device communicateswith each of the plurality of external electronic devices through theCIG event including the plurality of CIS events by sequentialarrangement or interleaved arrangement, the quality of communicationwith each of the plurality of external electronic devices may be reducedaccording to a change in the quality of the link according to a changein a wireless environment.

FIG. 2 illustrates an example of a wireless environment including anelectronic device according to an embodiment of the disclosure.

Referring to FIG. 2 , the wireless environment 200 may include anelectronic device 101, a first external electronic device 201, and asecond external electronic device 202.

The electronic device 101 in the wireless environment 200 may be anaudio source device such as e.g., a smartphone, a laptop computer, or atablet personal computer (PC). The electronic device 101 may transmitdata on audio played in the electronic device 101 to each of the firstexternal electronic device 201 and the second external electronic device202. For example, the data may be usable within each of the firstexternal electronic device 201 and the second external electronic device202 to output audio from each of the first external electronic device201 and the second external electronic device 202. The electronic device101 may be referred to as a master device.

The first external electronic device 201 and the second externalelectronic device 202 in the wireless environment 200 may be audio sinkdevices such as e.g., earbuds or earphones. For example, the firstexternal electronic device 201 and the second external electronic device202 may be configured as a pair, but it is not limited to thereto. Eachof the first external electronic device 201 and the second externalelectronic device 202 may receive the data from the electronic device101 and based on the data, output audio through a speaker of each of thefirst external electronic device 201 and the second external electronicdevice 202. Each of the first external electronic device 201 and thesecond external electronic device 202 may be referred to as a slavedevice.

The electronic device 101, the first external electronic device 201, andthe second external electronic device 202 may support multi-streamaudio. For example, synchronized and independent multiple audio streamsmay be transmitted between the electronic device 101 and the firstexternal electronic device 201 and/or between the electronic device 101and the second external electronic device 202. For example, in order tosupport the multi-stream audio, a connected isochronous group (CIG) 203including connected isochronous streams (CIS) may be used.

The CIG 203 may consist of two or more CISs with the same ISO(isochronous) interval. For example, the CIG 203 may include a first CIS204 and a second CIS 205. Each of the first CIS 204 and the second CIS205 may be a logical transport to cause the electronic device 101, thefirst external electronic device 201, and the second external electronicdevice 202 to transfer isochronous data unidirectionally orbidirectionally. Each of the first CIS 204 and the second CIS 205 may beassociated with an asynchronous connection (ACL). Each of the first CIS204 and the second CIS 205 may support packets of variable size andsupport transmitting one or more packets within an isochronous event.

The first CIS 204 may be used to transmit at least one packet from theelectronic device 101 to the first external electronic device 201. Forexample, the at least one packet may be used to output audio played inthe electronic device 101 through a speaker of the first externalelectronic device 201. The first CIS 204 may be used to transmit anacknowledgement signal for the at least one packet or anon-acknowledgement signal for the at least one packet, from the firstexternal electronic device 201 to the electronic device 101. Forexample, the acknowledgement signal may be transmitted from the firstexternal electronic device 201 to the electronic device 101 through thefirst CIS 204 to indicate that the first external electronic device 201successfully receives the at least one packet, and thenon-acknowledgement signal may be transmitted from the first externalelectronic device 201 to the electronic device 101 through the first CIS204 to indicate that the first external electronic device 201 fails toreceive the at least one packet.

The second CIS 205 may be used to transmit at least one packet from theelectronic device 101 to the second external electronic device 202. Forexample, the at least one packet may be used to output audio played inthe electronic device 101 through a speaker of the second externalelectronic device 202. The audio output through the speaker of the firstexternal electronic device 201 and the audio output through the speakerof the second external electronic device 202 may provide stereophonicsound, but it is not limited thereto. The second CIS 205 may be used totransmit an acknowledgement signal for the at least one packet or anon-acknowledgement signal for the at least one packet from the secondexternal electronic device 202 to the electronic device 101.

FIG. 3 is a simplified block diagram of an electronic device accordingto an embodiment of the disclosure. Components indicated by the blockdiagram may be included in the electronic device 101 illustrated in FIG.1 or the electronic device 101 illustrated in FIG. 2 .

FIG. 4A is a timing diagram illustrating a connected isochronous group(CIG) event having sequential arrangement according to an embodiment ofthe disclosure.

FIG. 4B is a timing diagram illustrating a CIG event having aninterleaved arrangement according to an embodiment of the disclosure.

FIGS. 5A, 5B, and 5C are timing diagrams illustrating a CIG event havinga hybrid arrangement according to various embodiments of the disclosure.

FIG. 6 is a timing diagram illustrating an anchor point of a CIG eventhaving a hybrid arrangement according to an embodiment of thedisclosure.

FIG. 7A illustrates methods of transmitting data through a CIG eventhaving a hybrid arrangement according to an embodiment of thedisclosure.

FIG. 7B illustrates an example of transmitting data through a CIG eventbased on identification of a designated event according to an embodimentof the disclosure.

Referring to FIG. 3 , the electronic device 101 may comprise a processor120, a memory 130, and a communication circuitry 190.

The processor 120 may comprise the processor 120 in FIG. 1 . The memory130 may comprise the memory 130 of FIG. 1 . The communication circuitry190 may include the communication module 190 of FIG. 1 used tocommunicate with an external electronic device (e.g., the first externalelectronic device 201 or the second external electronic device 202 shownin FIG. 2 ) through the first network 198.

The processor 120 in the electronic device 101 may obtain, configure, orset a CIG event (e.g., the event of the CIG 203 shown in FIG. 2 )including a first CIS event (e.g., an event of the first CIS 204 shownin FIG. 2 ) for the first external electronic device 201 and a secondCIS event (e.g., an event of the second CIS 205 shown in FIG. 2 ) forthe second external electronic device 202, in order to transmit data orat least one packet to each of the first external electronic device 201and the second external electronic device 202. For example, the CIGevent including the first CIS event and the second CIS event may startat a start timing of an initial sub-event of an initially scheduled CISand may end at an end timing of the last sub-event within an ISOinterval. For example, the anchor point of the CIG event may occursimultaneously with the anchor point of the first CIS event in the CIGevent.

Each of the first CIS event and the second CIS event may consist of oneor more sub-events. For example, the sub-event in the first CIS eventmay be used to transmit packets from the electronic device 101 andtransmit a response packet from the first external electronic device 201(e.g., the acknowledgement signal defined through the description ofFIG. 2 or the non-acknowledgement signal defined through the descriptionof FIG. 2 ). A sub-event in the second CIS event may be used fortransmitting a packet from the electronic device 101 and transmitting aresponse packet from the second external electronic device 202.

Each of the first CIS event and the second CIS event may be scheduled ina sequential arrangement or an interleaved arrangement within the CIGevent. For example, referring to FIG. 4A, as shown in the timing diagram400, the processor 120 may schedule a first CIS event 402 including afirst sub-event 404 and a second sub-event 405, and a second CIS event403 including a first sub-event 406 and a second sub-event 407 in a CIGevent 401 in the sequential arrangement. As shown in timing diagram 400,the processor 120 may acquire, configure, or set the CIG event 401including the first CIS event 402 and the second CIS event 403 in thesequential arrangement by scheduling the second CIS event 403immediately after the first CIS event 402. Since the first CIS event 402and the second CIS event 403 are scheduled back-to-back in thesequential arrangement, the first CIS event 402 and the second CIS event403 do not overlap each other in the sequential arrangement.

In another example, referring to FIG. 4B, as shown in timing diagram450, the processor 120 may schedule a first CIS event 402 including afirst sub-event 404 and a second sub-event 405, and a second CIS event403 including a first sub-event 406 and a second sub-event 407 in a CIGevent 401 in the interleaved arrangement. As shown in the timing diagram450, the processor 120 may obtain, configure, or set the CIG event 401including the first CIS event 402 and the second CIS event 403 in theinterleaved arrangement, by scheduling the first sub-event 406 in thesecond CIS event 403 immediately after the first sub-event 404 in thefirst CIS event 402, scheduling the second sub-event 405 in the firstCIS event 402 immediately after the first sub-event 406 in the secondCIS event 403, and scheduling the second sub-event 407 in the second CISevent 403 immediately after the second sub-event 405 in the first CISevent 402. For example, within the timing diagram 450, since the firstCIS event 402 starts at the start timing of the first sub-event 404 andends at the end timing of the second sub-event 405, while not includingthe first sub-event 406, and the second CIS event 403 starts at thestart timing of the first sub-event 406 and ends at the end timing ofthe second sub-event 407, while not including sub-event 405, the firstCIS event 402 and the second CIS event 403 do not overlap each other inthe interleaved arrangement. In each of the sequential arrangement andthe interleaved arrangement, since the processor 120 may transmit apacket once through each of the first sub-event 404, the secondsub-event 405, the first sub-event 406, and the second sub-event 407,the processor 120 may transmit a packet to the first external electronicdevice 201 at most twice through the first CIS event 402 and transmit apacket to the second external electronic device 202 at most twicethrough the second CIS event 403, in each of the sequential arrangementand the interleaved arrangement. In other words, in each of thesequential arrangement and the interleaved arrangement, the opportunityto transmit a packet through the first CIS event 402 is fixed and theopportunity to transmit a packet through the second CIS event 403 isfixed. For example, in each of the sequential arrangement and theinterleaved arrangement, the processor 120 may not adaptively change thenumber of times of transmitting a packet through the first CIS event 402and the number of times of transmitting a packet through the second CISevent 403, according to the quality of the first link between the firstexternal electronic device 201 and the electronic device 101, and thequality of the second link between the second external electronic device202 and the electronic device 101.

Referring back to FIG. 3 , the processor 120 may obtain, configure, orset the CIG event in order to adaptively change the number of times oftransmitting a packet through the first CIS event and the number oftimes of transmitting a packet through the second CIS event, byscheduling the second CIS event at least partially overlapping at leastpart of the first CIS event. For example, by scheduling the anchor pointof the second CIS event within the first CIS event, the processor 120may obtain the CIG event including the first CIS event and the secondCIS event at least partially overlapping at least part of the first CISevent. The processor 120 may obtain the CIG event including the firstCIS event and the second CIS event including the sub-event at leastpartially overlapping at least part of the sub-events in the first CISevent. Overlapping at least a part of the first CIS event and at least apart of the second CIS event may be referred to as a hybrid arrangementin terms of having both the characteristics of the sequentialarrangement and the characteristics of the interleaved arrangement.

The processor 120 may schedule the first CIS event and the second CISevent in the CIG event in the hybrid arrangement, based on satisfying aspecified condition.

For example, the processor 120 may schedule the first CIS event and thesecond CIS event in the CIG event in the hybrid arrangement, based onidentifying that at least one external electronic device (e.g., thefirst external electronic device 201 and the second external electronicdevice 202) supports the hybrid arrangement. The processor 120 mayschedule the first CIS event and the second CIS event in the CIG eventin the hybrid arrangement, based on identifying data indicating thesupport for the hybrid arrangement from capability information of the atleast one external electronic device received from the at least oneexternal electronic device. The processor 120 may schedule the first CISevent and the second CIS event in the CIG event in the hybridarrangement, based on identifying that a modulation scheme of a signalreceived from the at least one external electronic device indicatessupporting the hybrid arrangement.

For example, under the condition that an anchor point of at least someof the sub-events in the first CIS event corresponds to an anchor pointof at least some of the sub-events in the second CIS events, theprocessor 120 may obtain the CIG event including the second CIS eventincluding the sub-events at least partially overlapping at least a partof the sub-events in the first CIS event. Under the condition that atime interval between an anchor point of a first sub-event among thesub-events in the first CIS event and an anchor point of a secondsub-event immediately after the first sub-event among the sub-events inthe first CIS event is a multiple of a time interval between an anchorpoint of a third sub-event among the sub-events in the second CIS eventand an anchor point of a fourth sub-event immediately after the thirdsub-event of the sub-events in the second CIS event, the processor 120may obtain the CIG event including the second CIS event including thesub-events at least partially overlapping at least a part of thesub-events in the first CIS event. Under the condition that a timeinterval between an anchor point of the third sub-event among thesub-events in the second CIS event and an anchor point of the fourthsub-event among the sub-events in the second CIS event is a multiple ofa time interval between an anchor point of the first sub-event among thesub-events in the first CIS event and an anchor point of the secondsub-event among the sub-events in the first CIS event, the processor 120may obtain the CIG event including the second CIS event including thesub-events at least partially overlapping at least a part of thesub-events in the first CIS event. Under the condition that a length ofeach of the sub-events in the first CIS event is a multiple of a lengthof each of the sub-events in the second CIS events or the length of eachof the sub-events in the second CIS event is a multiple of the length ofeach of the sub-events in the first CIS events, the processor 120 mayobtain the CIG event including the second CIS event including thesub-events at least partially overlapping at least the part of thesub-events in the first CIS event. For example, under the condition thatthe length of each of the sub-events in the first CIS event is identicalto the length of each of the sub-events in the second CIS events, theprocessor 120 may obtain the CIG event including the first CIS event andthe second CIS event including sub-events at least partially overlappingat least a part of the sub-events in the first CIS event.

Referring to FIG. 5A, as shown in the timing diagram 500, the processor120 may set or obtain a CIG event 501 including a first CIS event 502and a second CIS event 503 partially overlapping part of the first CISevent 502. For example, the processor 120 may set or obtain the CIGevent 501 by scheduling the first CIS event 502 and the second CIS event503 so that each of the kth sub-event 502-k (k is a natural numbergreater than 1 and less than n) to n-th sub-event 502-n in the first CISevent 502 overlaps each of the first sub-event 503-1 to (n−k+1)thsub-event 503-(n−k+1) in the second CIS event 503. Since the first CISevent 502 includes kth sub-events 502-k to n-th sub-events 502-n eachoverlapping the first sub-events 503-1 to (n−k+1)th sub-event503-(n−k+1) and the first sub-events 502-1 to (k−1)th sub-event502-(k−1) that do not overlap the second CIS event 503, the number oftimes of transmitting a packet through the first CIS event 502 may be(k−1) to n times. Within the timing diagram 500, since the second CISevent 503 includes first sub-event 503-1 to (n−k+1)th sub-event503-(n−k+1) each overlapping kth sub-event 502-k to nth sub-event 502-nand (n−k+2)th sub-event 503-(n−k+2) to nth sub-event 503-n that do notoverlap the first CIS event 502, the number of times of transmitting apacket through the second CIS event 503 may be k−1 times to n times. Forexample, the processor 120 may transmit a packet 505 for the firstexternal electronic device 201 through at least a part of a timeinterval (e.g., first sub-event 502-1 to (k−1)th sub-event 502-(k−1)) ofthe first CIS event 502 that does not overlap the second CIS event 503;and transmit one of a packet 505 for the first external electronicdevice 201 and a packet 506 for the second external electronic device202 through at least a portion of the time interval (e.g., k-thsub-event 502-k to n-th sub-event 502-n) of the first CIS event 502overlapping the second CIS event 503 (or a time interval (e.g., firstsub-event 503-1 to (n−k+1)th sub-event 503-(n−k+1) of the second CISevent 503 overlapping the first CIS event 502)); and transmit a packet506 for the second external electronic device 202 through at least aportion of the time interval (e.g., (n−k+2)th sub-event 503-(n−k+2) ton-th sub-event 503-n) of the second CIS event 503 that does not overlapthe first CIS event 502. For example, based on transmitting the lasttarget packet transmitted to the first external electronic device 201through the first CIS event 502 to the first external electronic device201 through the kth sub-event 502-k and receiving the acknowledgementsignal for the last target packet from the first external electronicdevice 201 through the kth sub-event 502-k, the processor 120 maytransmit the packet 506 to the second external electronic device 202through each of the second sub-event 503-2 to (n−k+1)th sub-event503-(n−k+1) and cease transmitting the packet 505 to the first externalelectronic device 201 through the sub-event 502-(k+1) to the sub-event502-n. In this situation, the last target packet may refer to a packetthat is last transmitted among scheduled target packets, which istransmitted to the first external electronic device 201 in the first CISevent 502 based on a burst number (BN) and a flush timeout (FT) of thefirst CIS event 502.

The processor 120 may adaptively change the number of times a packet istransmitted to the first external electronic device 201 through the CIGevent 501 and the number of times a packet is transmitted to the secondexternal electronic device 202 through the CIG event 501, by obtainingthe CIG event 501 including the first CIS event 502 and the second CISevent 503 partially overlapping a part of the first CIS event 502. Forexample, when the quality of the first link between the first externalelectronic device 201 and the electronic device 101 is much better thanthe quality of the second link between the second external electronicdevice 202 and the electronic device 101, the processor 120 may enhancethe quality of multi-stream audio by allocating a time interval of thesecond CIS event 503 partially overlapped with a part of the first CISevent 502 with a time interval for transmitting packets to the secondexternal electronic device 202.

FIG. 5A illustrates an example that the length of each of the firstsub-event 502-1 to n-th sub-event 502-n in the first CIS event 502 isthe same as the length of the first sub-event 503-1 to n-th sub-events503-n in the second CIS event 503, but this is only for convenience ofdescription. For example, although not shown in FIG. 5A, even when thelength of each of the first sub-event 502-1 to n-th sub-events 502-n inthe first CIS event 502 is different from the length of the firstsub-events 503-1 to n-th sub-events 503-n in the second CIS event 503,the processor 120 may obtain the CIG event 501 including the first CISevent 502 and the second CIS event 503 at least partially overlapping atleast a part of the first CIS event 502, under the condition that eachof the anchor points of at least a part of the first sub-event 502-1 ton-th sub-event 502-n in the first CIS event 502 (e.g., k-th sub-event502-k to n-th sub-event 502-n) corresponds to each of the anchor pointsof at least a part of the first sub-event 503-1 to n-th sub-event 503-nin the second CIS event 503 (e.g., the first sub-event 503-1 to(n−k+1)th sub-event 503-(n−k+1)).

Although not shown in FIG. 5A, under the condition that an intervalbetween the anchor points of the first sub-event 502-1 to n-th sub-event502-n in the first CIS event 502 is a multiple of an interval betweenthe anchor points of the first sub-event 503-1 to n-th sub-event 503-nin the second CIS event 503, and an offset of the anchor point of eachof the first sub-event 502-1 to n-th sub-event 502-n in the first CISevent 502 corresponds to an offset of the anchor point of each of thefirst sub-event 503-1 to n-th sub-event 503-n in the second CIS event503, the processor 120 may obtain the CIG event 501 including the firstCIS event 502 and the second CIS event 503 at least partiallyoverlapping at least a part of the first CIS event 502.

Although not shown in FIG. 5A, under the condition that an intervalbetween the anchor points of the first sub-event 503-1 to n-th sub-event503-n in the second CIS event 502 is a multiple of an interval betweenthe anchor points of the first sub-event 502-1 to n-th sub-event 502-nin the first CIS event 502, and an offset of the anchor point of each ofthe first sub-event 502-1 to n-th sub-event 502-n in the first CIS event502 corresponds to an offset of the anchor point of each of the firstsub-event 503-1 to n-th sub-event 503-n in the second CIS event 503, theprocessor 120 may obtain the CIG event 501 including the first CIS event502 and the second CIS event 503 at least partially overlapping at leasta part of the first CIS event 502.

In another example, referring to FIG. 5B, as shown in the timing diagram550, the processor 120 may obtain a CIG event 551 including a first CISevent 552 and a second CIS event 553 completely overlapping the firstCIS event 552. For example, the processor 120 may obtain the CIG event551 by scheduling the first CIS event 552 and the second CIS event 553such that each of the first sub-event 552-1 to the fourth sub-event552-4 in the first CIS event 552 overlaps each of the first sub-event553-1 to the fourth sub-event 553-4 in the second CIS event 553. Sincethe first CIS event 552 and the second CIS event 553 completely overlapeach other within the CIG event 551, the processor 120 may adaptivelychange the number of times a packet may be transmitted through the firstCIS event 552 and the number of times a packet may be transmittedthrough the second CIS event 553. For example, based on transmitting thelast target packet transmitted to the first external electronic device201 through the first CIS event 552 to the first external electronicdevice 201 through the first sub-event 552-1 and receiving anacknowledgement signal for the last target packet from the firstexternal electronic device 201 through the first sub-event 552-1, theprocessor 120 may stop transmitting packets to the first externalelectronic device 201 through the second sub-event 552-2 to the fourthsub-event 552-4, which are remaining sub-events of the first CIS event552, and transmit the packets to the second external electronic device202 through at least a part of the second sub-event 553-2 to the fourthsub-event 553-4. The processor 120 may enhance the quality ofmulti-stream audio by adaptively changing a time interval fortransmitting a packet for the first external electronic device 201 and atime interval for transmitting a packet for the second externalelectronic device 202 within the CIG event 551, according to thedifference between the quality of the first link and the quality of thesecond link.

FIG. 5B illustrates an example that the length of each of the firstsub-event 552-1 to the fourth sub-event 552-4 in the first CIS event 552is the same as the length of each of the first sub-event 553-1 to thefourth sub-event 553-4 in the second CIS event 553, but this is only forconvenience of description. For example, although not shown in FIG. 5B,even when the length of each of the first sub-event 552-1 to the fourthsub-event 552-4 in the first CIS event 552 and the length of each of thefirst sub-event 553-1 to the fourth sub-event 553-4 in the second CISevent 553 are different from each other, the processor 120 may obtainthe CIG event 551 including the first CIS event 552 and the second CISevent 553 overlapped with the first CIS event 552, under the conditionthat the anchor point of each of the first sub-event 552-1 to the fourthsub-event 552-4 in the first CIS event corresponds to the anchor pointof each of the first sub-event 553-1 to the fourth sub-event 553-4 inthe second CIS event 553. For example, although not shown in FIG. 5B,under the condition that the interval between the anchor points of thefirst sub-event 552-1 to the fourth sub-event 552-4 in the first CISevent 552 is a multiple of the interval between the anchor points of thefirst sub-event 553-1 to the fourth sub-event 553-4 in the second CISevent 553, and the offset of each of the anchor points of the firstsub-event 552-1 to the fourth sub-event 552-4 in the first CIS event 552corresponds to the offset of each of the anchor points of the firstsub-event 553-1 to the fourth sub-event 553-4 in the second CIS event553, the processor 120 may obtain the CIG event 551 including the firstCIS event 552 and the second CIS event 553 overlapping the first CISevent 552. Such a CIG event 551 is described below with respect to FIG.5C.

For example, although not shown in FIG. 5B, under the condition that theinterval between the anchor points of the first sub-event 553-1 to thefourth sub-event 553-4 in the second CIS event 553 is a multiple of theinterval between the anchor points of the first sub-event 552-1 to thefourth sub-event 552-4 in the first CIS event 553, and the offset ofeach of the anchor points of the first sub-event 552-1 to the fourthsub-event 552-4 in the first CIS event 552 corresponds to the offset ofeach of the anchor points of the first sub-event 553-1 to the fourthsub-event 553-4 in the second CIS event 553, the processor 120 mayobtain the CIG event 551 including the first CIS event 552 and thesecond CIS event 553 overlapping the first CIS event 552.

Referring to FIG. 5C, as shown in timing diagram 570, the processor 120may obtain a CIG event 571 including a first CIS event 572 and a secondCIS event 573 fully overlapped with the first CIS event 572. Forexample, the processor 120 may obtain the CIG event 571 by schedulingthe first CIS event 572 and the second CIS event 573, so that the firstsub-event 572-1 of the first CIS event 572 overlaps the first sub-event573-1 and the second sub-event 573-2 of the second CIS event 573, thesecond sub-event 572-2 of the first CIS event 572 overlaps the thirdsub-event 573-3 and the fourth sub-event 573-4 of the second CIS event573, the third sub-event 572-3 of the first CIS event 572 overlaps thefifth sub-event 573-5 and the sixth sub-event 573-6 of the second CISevent, and the fourth sub-event 572-4 of the first CIS event 572overlaps the seventh sub-event 573-7 and the eighth sub-event 573-8 ofthe second CIS event 573. Unlike the CIG event 501 and the CIG event 551respectively shown in FIGS. 5A and 5B, the number of sub-events of thefirst CIS event 572 of the CIG event 571 may be different from thenumber of sub-events of the second CIS event 573 of the CIG event 571.For example, the interval between the anchor points of the sub-events ofthe first CIS event 572 of the CIG event 571 may be longer than theinterval between the anchor points of the sub-events of the second CISevent 573 of the CIG event 571, as opposed to the CIG event 501 and theCIG event 551 respectively shown in FIGS. 5A and 5B. Unlike the CIGevent 501 and the CIG event 551 respectively shown in FIGS. 5A and 5B,the number of times a packet may be transmitted through the first CISevent 572 may be different from the number of times a packet may betransmitted through the second CIS event 573. For example, the intervalbetween the anchor points of the sub-events of the first CIS event 572of the CIG event 571 may be a multiple of the interval between theanchor points of the sub-events of the second CIS event 573 of the CIGevent 571.

The offset of the anchor point of each of the sub-events of the firstCIS event 572 of the CIG event 571 may be the same as the offset of theanchor point of each of the sub-events of the second CIS event 573 ofthe CIG event 571. For example, the position of the anchor point of thefirst sub-event 572-1 of the first CIS event 572 may be the same as theposition of the anchor point of the first sub-event 573-1 of the secondCIS event 573, the position of the anchor point of the second sub-event572-2 of the first CIS event 572 may be the same as the position of theanchor point of the third sub-event 573-3 of the second CIS event 573,the position of the anchor point of the third sub-event 572-3 of thefirst CIS event 572 may be the same as the position of the anchor pointof the fifth sub-event 573-5 of the second CIS event 573, and theposition of the anchor point of the fourth sub-event 572-4 of the firstCIS event 572 may be the same as the position of the anchor point of theseventh sub-event 573-7 of the second CIS event 573. For example, theanchor point of the second sub-event 573-2 of the second CIS event 573may be within the first sub-event 572-1 of the first CIS event 572, theanchor point of the fourth sub-event 573-4 of the second CIS event 573may be within the second sub-event 572-2 of the first CIS event 572, theanchor point of the sixth sub-event 573-6 of the second CIS event 573may be within the third sub-event 572-3 of the first CIS event 572, andthe anchor point of the eighth sub-event 573-8 of the second CIS event573 may be within the fourth sub-event 572-4 of the first CIS event 572.For example, the sub-events of the first CIS event 572 may besynchronized with the sub-events of the second CIS event 573.

Since the interval between the anchor points of the sub-events of thefirst CIS event 572 within a time interval for the CIG event 571 islonger than the interval between the anchor points of the sub-events ofthe second CIS event 573 within the time interval, the time interval maybe a time interval that can adaptively select either one of transmissionto the first external electronic device 201 and transmission to thesecond external electronic device 202, for each sub-event of the firstCIS event 572.

Referring back to FIG. 3 , the processor 120 may adaptively change aninitial CIS event (e.g., a CIS event that occurred first between thefirst CIS event and the second CIS event) in the CIG event including thefirst CIS event and the second CIS event, in order to uniformlydistribute time resources provided for the first CIS event and timeresources provided for the second CIS event at least partiallyoverlapping at least part of the first CIS event. For example, theprocessor 120 may schedule the first CIS event and the second CIS eventin the first CIG event so that the anchor point of the first CIS eventin the first CIG event occurs simultaneously with an anchor point of thefirst CIG event and occurs before the anchor point of the second CISevent in the first CIG event, and may schedule the first CIS event andthe second CIS event in the second CIG event so that the anchor point ofthe first CIS event in the second CIG event immediately after the firstCIG event occurs simultaneously with the anchor point of the second CIGevent and occurs before the anchor point of the second CIS event in thesecond CIG event. The processor 120 may uniformly distribute the timeresources provided for the first CIS event and the time resourcesprovided for the second CIS event at least partially overlapping atleast part of the first CIS event, by allocating the initial CIS eventin the (2k−1)th CIG event (here, k is a natural number greater than orequal to 1) to the first CIS event, and allocating the initial CIS eventin the 2k-th CIG event as the second CIS event. Referring to FIG. 6 , asshown in the timing diagram 600, the processor 120 may schedule a CISevent starting at an anchor point 605 of k-th CIG event 601-k as a firstCIS event 602 between the first CIS event 602 and a second CIS event 603partially overlapping part of the first CIS event 602, and schedule aCIS event starting at an anchor point 607 of (k+1)th CIG event 601-(k+1)immediately after the k-th CIG event 601-k as a second CIS event 603between the first CIS event 602 and the second CIS event 603 partiallyoverlapping part of the first CIS event 602.

Referring back to FIG. 3 , an attribute of data in the packet that canbe transmitted through the first CIS event, which is the first CIS eventin the CIG event, may correspond to an attribute of data included in thepacket that may be transmitted through the second CIS event at leastpartially overlapping at least part of the first CIS event. Theprocessor 120 may obtain the first CIS event for the first packets to betransmitted to the first external electronic device 201 and obtain thesecond CIS event for the second packets, to be transmitted to the secondexternal electronic device 202 associated with the first externalelectronic device 201, the second packets corresponding to the firstpackets, respectively. For example, since the first packets correspondto the second packets, the processor 120 may transmit the first packetsand the second packets in various schemes through the first CIS eventand the second CIS event at least partially overlapping at least part ofthe first CIS event.

The processor 120 may transmit the second packets through at least partof the second CIS event, under the condition that the transmission ofthe first packets is completed through at least part of the first CISevent, which is the first CIS event in the CIG event. Such a schedulingof transmitting the second packets after completing the transmission ofthe first packets makes it possible to change the number of sub-eventsin the first CIS event used for transmission of the first packets andchange the number of sub-events in the second CIS event used fortransmission of the second packets, unlike transmitting the firstpackets and the second packets using the sequential arrangement, andthus, transmitting the second packets after completing transmission ofthe first packets in the hybrid arrangement makes it possible to providemore enhanced service than transmitting the first packets and the secondpackets using the sequential arrangement.

Referring to FIG. 7A, the processor 120 may transmit the second packetsto the second external electronic device 202 through at least part ofthe second CIS event 712 at least partially overlapping at least part ofthe first CIS event 711, after completing transmission of the firstpacket 713-1, the first packet 713-2 and the first packet 713-3 to thefirst external electronic device 201 through at least part of the firstCIS event 711 in the CIG event 710. In that case, the number ofsub-events in the second CIS event 712 that are available fortransmitting the second packets may change depending on when thetransmission of the first packets is complete. For example, as shown inthe timing diagram 700, when the first packet 713-3 is re-transmitted asopposed to the first packet 713-1 and the first packet 713-2, theprocessor 120 may transmit the second packets to the second externalelectronic device 202 through a portion 714 of the second CIS event 712including four sub-events. As shown in the timing diagram 701, when thetransmission of the first packets including the first packet 713-1, thefirst packet 713-2 and the first packet 713-3 is completed withoutretransmission, the processor 120 may transmit the second packets to thesecond external electronic device 202 through a portion 715 of thesecond CIS event 712 including five sub-events. The hybrid arrangementcan provide more adaptive transmission opportunities than the sequentialarrangement because the hybrid arrangement makes it possible to changetransmission opportunities, as opposed to the sequential arrangement.

The processor 120 may transmit one of the first packets or the secondpackets in an alternating manner, and then continue to transmit theother, under the condition that either one of the transmission of thefirst packets and the transmission of the second packets is completed.For example, since such a transmission scheduling enables continuoustransmission as well as alternating transmission, transmitting the firstpackets and the second packets in the hybrid arrangement makes itpossible to provide more enhance service than transmitting the firstpackets and the second packets using the interleaved arrangement.

Referring to FIG. 7A, the processor 120 may perform, alternately inunits of sub-events, transmission of the first packets (e.g., the firstpacket 723-1, the first packet 723-2, and the first packet 723-3) to thefirst external electronic device 201, and transmission of the secondpackets (e.g., the second packet 724-1, the second packet 724-2, and thesecond packet 724-3) to the second external electronic device 202, usingthe first CIS event 721 in the CIG event 720 and the second CIS event722 in the CIG event 720 overlapping the first CIS event 721. Forexample, as shown in the timing diagram 702, the processor 120 maytransmit the second packet 724-1 to the second external electronicdevice 202 through the second CIS event 722 after transmitting the firstpacket 723-1 to the first external electronic device 201 through thefirst CIS event 721, transmit the first packet 723-2 to the firstexternal electronic device 201 through the first CIS event 721 aftertransmitting the second packet 724-1, re-transmit the second packet724-1 to the second external electronic device 202 through the secondCIS event 722 after transmitting the first packet 723-2, and transmitthe first packet 723-3 to the first external electronic device 201 afterre-transmitting the second packet 724-1. Under the condition that thetransmission of the first packet 723-3 succeeds and the retransmissionof the second packet 724-1 succeeds, the processor 120 may transmit thesecond packet 724-2 and the second packet 724-3 to the second externalelectronic device 202 through a portion 725 of the second CIS event 722including three sub-events. As opposed to the interleaved arrangement inwhich it has to transmit the second packet 724-2 and the second packet724-3 through two sub-events due to the sub-event in the first CIS event721 (e.g., a sub-event 726) even though the transmission of the firstpackets has been completed, the hybrid arrangement makes it possible totransmit the second packet 724-2 and the second packet 724-3 through theportion 725 of the second CIS event 722 including the three sub-events.For example, the hybrid deployment can provide more adaptivetransmission opportunities than the interleaved arrangement.

Referring back to FIG. 3 , an attribute of data in the packet that maybe transmitted through the first CIS event, which is an initial CISevent in the CIG event, may be distinguished from an attribute of dataincluded in the packet that may be transmitted through the second CISevent at least partially overlapping at least part of the first CISevent. For example, when both the first CIS event and the second CISevent are obtained, set, or scheduled for packets to be transmitted toan external electronic device, the processor 120 may transmit a packetincluding data obtained in every cycle to the external electronic devicethrough the first CIS event that starts before the second CIS event andtransmit a packet including data obtained based on identifying adesignated event to the external electronic device through the secondCIS event. A size of a buffer for data transmitted through the first CISevent may be larger than a size of a buffer for data transmitted throughthe second CIS event, but it is not limited thereto. The processor 120may transmit a packet for audio continuously provided through the firstCIS event that starts before the timing of starting the second CIS eventand transmit a packet for audio provided on condition of identifying adesignated event through the second CIS event.

Referring to FIG. 7B, the processor 120 may display a user interface 730of a game executed in the electronic device 101 through a display of theelectronic device 101 (e.g., the display module 160 shown in FIG. 1 ).While displaying the user interface 730, for outputting background music(BGM) of the game and sound effects provided based on a user inputreceived through the user interface 730, using the external electronicdevice 735, the processor 120, as shown in a timing diagram 740, mayobtain a first CIG event 750 including a first CIS event 751 and asecond CIS event 752 partially overlapping part of the first CIS event751 and obtain a second CIG event 760 including a first CIS event 761and a second CIS event 762 partially overlapping part of the first CISevent 761. For example, the processor 120 may transmit a packet 770 forthe BGM continuously outputted while executing the game, to the externalelectronic device 735 through each of the first CIS event 751 and thefirst CIS event 761, which is an initial CIS event of each of the firstCIG event 750 and the second CIG event 760, and transmit a packet 771for the sound effect provided on condition of receiving the user input,to the external electronic device 735 through each of the second CISevent 752 and the second CIS event 762. For example, when the user inputgenerating the sound effect is not received for the first CIG event 750,the processor 120, as shown in the timing diagram 740, may transmit apacket 770 to the external electronic device 735 through the first CISevent 751 in the first CIG event 750, and transmit no packet through thesecond CIS event 752 in the first CIG event 750 or transmit a dummypacket 772 through the second CIS event 752 in the first CIG event 750.In another example, when a user input 780 generating the sound effect isreceived for the second CIG event 760, as shown in the timing diagram740, the processor 120 may transmit a packet 770 to the externalelectronic device 735 through part of the first CIS event 761 in thesecond CIG event 760, and transmit a packet 771 to the externalelectronic device 735 through part of the second CIS event 762 in thesecond CIG event 760 overlapping part of the first CIS event 761. Thepriority of the packet 771 associated with the user input 780 may behigher than the priority of the packet 770. For example, even when thetransmission of the packet 770 is not completed through the part of thefirst CIS event 761, the processor 120 may transmit the packet 771through the part of the second CIS event 762 overlapping the part of thefirst CIS event 761, in response to receiving the user input 780. Inother words, the processor 120 may allocate a plurality of CIS eventsfor respectively transmitting packets having different priorities to asingle external electronic device such as the external electronic device735, and schedule the plurality of CIS events to be fully or partiallyoverlapped with each other.

FIG. 8 is a flowchart illustrating a method of transmitting data via aCIG event including a first CIS event and a second CIS event in a hybridarrangement according to an embodiment of the disclosure. This methodmay be executed by the electronic device 101 illustrated in FIG. 1 , theelectronic device 101 illustrated in FIG. 2 , the electronic device 101illustrated in FIG. 3 , or the processor 120 of the electronic device101.

Referring to FIG. 8 , in operation 802, the processor 120 may obtain aCIG event including a first CIS event and a second CIS event at leastpartially overlapping at least part of the first CIS event. The CIGevent may include the first CIS event and the second CIS event in thehybrid arrangement. The first CIS event may be an event used to transmitdata to a first external electronic device (e.g., the first externalelectronic device 201 shown in FIG. 2 ), and the second CIS event may bean event used to transmit data to a second external electronic device(e.g., the second external electronic device 202 shown in FIG. 2 ). Thefirst CIS event may include first sub-events, and the second CIS eventmay include second sub-events at least partially overlapping at leastpart of the first sub-events. By configuring the anchor point of thesecond CIS event within the first CIS event initiated from the anchorpoint of the first CIS event, the processor 120 may obtain the CIG eventincluding the first CIS event including the first sub-events and thesecond CIS event including the second sub-event at least partiallyoverlapping at least part of the first sub-events, although it is notlimited thereto.

According to an embodiment of the disclosure, the processor 120 mayperform operation 802 based on identifying that the first externalelectronic device and the second external electronic device supportincluding the first CIS event and the second CIS event in the CIG eventin the hybrid arrangement. For example, based on receiving capabilityinformation of the first external electronic device from the firstexternal electronic device and receiving capability information of thesecond external electronic device from the second external electronicdevice, the processor 120 may determine including the first CIS eventand the second CIS event in the CIG event in the hybrid arrangement, andexecute operation 802 based on the determination. However, it is notlimited thereto.

In operation 804, the processor 120 may transmit first data to the firstexternal electronic device through the first sub-event in the first CISevent. The first sub-event may be one of the first sub-events in thefirst CIS event. The first sub-event may overlap one of the secondsub-events in the second CIS event or may not overlap all the secondsub-events. When the first sub-event does not overlap all of the secondsub-event, the last sub-event of the second sub-event may not overlapall of the first sub-events.

In operation 806, the processor 120 may receive an acknowledgementsignal from the first external electronic device through the firstsub-event in the first CIS event. For example, the first externalelectronic device may set NESN (nextExpectedSeqNum) in the packet to SN(transmitSeqNum), based on receiving the packet including the first datathrough the first sub-event, and transmit a response packet includingthe set SN to the electronic device 101 through the first sub-event asthe acknowledgement signal. The processor 120 may identify that thefirst data is normally received by the first external electronic devicethrough the first sub-event based on receiving the acknowledgementsignal.

In operation 808, the processor 120 may transmit second data to thesecond external electronic device through a third sub-event in thesecond CIS event, based on receiving the acknowledgement signal from thefirst external electronic device through the first sub-event. Forexample, the third sub-event in the second CIS event may be a sub-eventof the second sub-events in the second CIS event overlapping the secondsub-event immediately after the first sub-event among the firstsub-events. The third sub-event in the second CIS event may be asub-event initiating the second CIS event, although it is not limitedthereto. The processor 120 may transmit, to the second externalelectronic device, at least one packet including the second data throughat least one sub-event including the third sub-event in the second CISevent, although it is not limited thereto.

Although not shown in FIG. 8 , the processor may, based on receiving theacknowledgement signal from the first external electronic device throughthe first sub-event, cease transmitting data to the first externalelectronic device through all the remaining sub-events in the first CISevent in the CIG event.

As described above, the electronic device 101 may adaptively distributethe time resources for transmitting data to the first externalelectronic device and the time resources for transmitting data to thesecond external electronic device, according to a change in at least oneof a state of a first link between the first external electronic deviceand the electronic device 101 or a state of a second link between thesecond external electronic device and the electronic device 101, byconfiguring the CIG event including the first CIS event and the secondCIS event in the hybrid arrangement. For example, the electronic device101 may configure the CIG event including the first CIS event and thesecond CIS event in the hybrid arrangement, thereby increasing theamount of time resources that may be allocated to each of the first CISevent and the second CIS event.

FIG. 9A is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement, based on synchronization of an anchor point of each of thefirst sub-events in the first CIS event and an anchor point of each ofthe second sub-events in the second CIS event, according to anembodiment of the disclosure. This method may be executed by theelectronic device 101 shown in FIG. 1 , the electronic device 101 shownin FIG. 2 , the electronic device 101 shown in FIG. 3 , or the processor120 of the electronic device 101.

Operations 902 to 904 of FIG. 9A may be associated with operation 802 ofFIG. 8 .

Referring to FIG. 9A, in operation 902, the processor 120 may identifywhether or not the anchor point of each of the first sub-events in thefirst CIS event defined through the description of FIG. 8 issynchronized with the anchor point of each of the second sub-events inthe second CIS event defined through the description of FIG. 8 . Whenthe anchor point of each of the first sub-events is synchronized withthe anchor point of each of the second sub-events, it may mean that anoffset of the anchor point of each of the first sub-events coincideswith an offset of each of the anchor points in the second sub-events,and that an interval between the anchor points of the first sub-eventsis a multiple of an interval between anchor points of the secondsub-events. When the anchor point of each of the first sub-events issynchronized with the anchor point of each of the second sub-events, itmay mean that the offset of the anchor point of each of the firstsub-events coincides with the offset of the anchor point of each of thesecond sub-events, and that the interval between the anchor points ofthe second sub-events is a multiple of the interval between the anchorpoints of the first sub-events. When the anchor point of each of thefirst sub-events is synchronized with the anchor point of each of thesecond sub-events, it may mean that regardless (or independently) of thelength of each of the first sub-events and the length of each of thesecond sub-events, it is possible to perform scheduling to overlap atleast part of the first sub-events and at least part of the secondsub-events, so the processor 120 may identify whether the anchor pointof each of the first sub-events is synchronized with the anchor point ofeach of the second sub-events.

The processor 120 may execute operation 904 on condition that the anchorpoint of each of the first sub-events is synchronized with the anchorpoint of each of the second sub-events, and execute operation 906 oncondition that the anchor point of each of the first sub-events is notsynchronized with the anchor point of each of the second sub-events.

In operation 904, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event partially overlapping atleast part of the first CIS event, based on identifying that the anchorpoint of each of the first sub-events is synchronized with the anchorpoint of each of the second sub-events. For example, the processor 120may obtain the CIG event including the first CIS event and the secondCIS event in the hybrid arrangement.

In operation 906, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event either in the sequentialarrangement or in the interleaved arrangement, based on identifying thatthe anchor point of each of the first sub-events is not synchronizedwith the anchor point of each of the second sub-events.

FIG. 9B is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement, based on the length of each of the first sub-events in thefirst CIS event and the length of each of the second sub-events in thesecond CIS event according to an embodiment of the disclosure. Thismethod may be executed by the electronic device 101 illustrated in FIG.1 , the electronic device 101 illustrated in FIG. 2 , the electronicdevice 101 illustrated in FIG. 3 , or the processor 120 of theelectronic device 101.

Operations 912 to 914 of FIG. 9B may be associated with operation 802 ofFIG. 8 .

Referring to FIG. 9B, in operation 912, the processor 120 may identifywhether a length of each of the first sub-events in the first CIS eventdefined through the description of FIG. 8 is identical to a length ofeach of the second sub-events in the second CIS event defined throughthe description of FIG. 8 . When the length of each of the firstsub-events is identical to the length of each of the second sub-events,it may mean that it is possible to perform scheduling to overlap atleast part of the first sub-events and at least part of the secondsub-events, so the processor 120 may identify whether the length of eachof the first sub-events is identical to the length of each of the secondsub-events. The processor 120 may identify whether the length of each ofthe first sub-events is identical to the length of each of the secondsub-events, by identifying a parameter (e.g., SE_length) of the firstCIS event indicating the length of each of the first sub-events in thefirst CIS event and a parameter of the second CIS event indicating thelength of each of the second sub-events in the second CIS event.

The processor 120 may execute operation 914 on condition that the lengthof each of the first sub-events is identical to the length of each ofthe second sub-events, and processor 120 may execute operation 916 oncondition that the length of each of the first sub-events is differentfrom the length of each of the second sub-events.

In operation 912, the processor 120 may further identify whether a starttiming of each of the first sub-events is synchronized with a starttiming of each of the second sub-events. For example, when the length ofeach of the first sub-events is identical to the length of each of thesecond sub-events, and the start timing of each of the first sub-eventsis synchronized with the start timing of each of the second sub-events,it may mean that it possible to perform scheduling to overlap at leastpart of the first sub-events and at least part of the second sub-events,so the processor 120 may execute a comparison between the length of eachof the first sub-events and the length of each of the second sub-eventsand a comparison between the start timing of each of the firstsub-events and the start timing of each of the second sub-events. Theprocessor 120 may execute operation 914 on condition that the length ofeach of the first sub-events is identical to the length of each of thesecond sub-events and the start timing of each of the first sub-eventsis synchronized with the start timing of each of the second sub-events,otherwise execute operation 916.

In operation 914, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event at least partiallyoverlapping at least part of the first CIS event, based on identifyingthat the length of each of the first sub-events is identical to thelength of each of the second sub-events. For example, the processor 120may obtain the CIG event including the first CIS event and the secondCIS event in the hybrid arrangement.

In operation 916, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event either in the sequentialarrangement or the interleaved arrangement, based on identifying thatthe length of each of the first sub-events is different from the lengthof each of the second sub-events.

FIG. 10 is a flowchart illustrating a method of transmitting data withina time interval in which at least part of the first CIS event overlapsat least part of the second CIS event, according to an embodiment of thedisclosure. This method may be executed by the electronic device 101illustrated in FIG. 1 , the electronic device 101 illustrated in FIG. 2, the electronic device 101 illustrated in FIG. 3 , or the processor 120of the electronic device 101.

Operations 1002 and 1006 of FIG. 10 may be associated with the operation808 of FIG. 8 .

Referring to FIG. 10 , in operation 1002, after executing operation 806,the processor 120 may identify whether the first data transmittedthrough operation 804 is the last target data transmitted to the firstexternal electronic device through the first CIS event. For example,when it is received the acknowledgement signal for the first data, whichis the last target data, in operation 806, it may mean that transmissionof all data scheduled for the first CIS event is completed. When thetransmission of all scheduled data for the first CIS event is completed,there is no need to transmit data through the second sub-event in thefirst CIS event immediately after the first sub-event, so the processor120 may identify whether the first data is the last target data. Oncondition that the first data is the last target data, the processor 120may execute operation 1004, while on condition that the first data isnot the last target data, the processor 120 may execute operation 1006.

In operation 1004, based on identifying that the first data is the lasttarget data, the processor 120 may transmit second data through thethird sub-event in the second CIS event at least partially overlappingat least part of the first CIS event. For example, operation 1004 maycorrespond to operation 808 of FIG. 8 .

In operation 1006, based on identifying that the first data is not thelast target data, the processor 120 may transmit another data subsequentto the first data through the second sub-event in the first CIS event.

As described above, when transmission of all data scheduled for thefirst CIS event has been completed before the end of the first CISevent, the electronic device 101 may transmit data to the secondexternal electronic device through sub-events in the second CIS eventoverlapping the remaining sub-events instead of the remaining sub-eventsin the first CIS event. In other words, the electronic device 101 mayuse the CIG event including the first CIS event and the second CIS eventin the hybrid arrangement to increase the number of transmissions to thesecond external electronic device through the second CIS event.

FIG. 11 is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement, based on attributes of data, according to an embodiment ofthe disclosure. This method may be executed by the electronic device 101illustrated in FIG. 1 , the electronic device 101 illustrated in FIG. 2, the electronic device 101 illustrated in FIG. 3 , or the processor 120of the electronic device 101.

Operations 1102 to 1104 of FIG. 11 may be associated with operation 802of FIG. 8 .

Referring to FIG. 11 , in operation 1102, the processor 120 may identifywhether the first data or the second data is associated with amultimedia content. For example, the processor 120 may identify whetherthe first data or the second data is associated with the multimediacontent in order to identify whether a size of the first data to betransmitted through the first CIS event or a size of the second data tobe transmitted through the second CIS event requires configuring the CIGevent including the first CIS event and the second CIS event in thehybrid arrangement. In another example, the processor 120 may identifywhether the first data or the second data is associated with themultimedia content in order to identify whether the load of the firstexternal electronic device for processing the first data to betransmitted through the first CIS event or the load of the secondexternal electronic device for processing the second data to betransmitted through the second CIS event requires configuring the CIGevent including the first CIS event and the second CIS event in thehybrid arrangement. In another example, the processor 120 may identifywhether the first data or the second data is associated with themultimedia content in order to identify whether the quality of service(QoS) of the first data to be transmitted through the first CIS event orthe quality of service (QoS) of the second data to be transmittedthrough the second CIS event requires configuring the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement. In another example, the processor 120 may identify whetherthe first data or the second data is associated with the multimediacontent in order to identify whether multi-stream audio is providedthrough the first external electronic device and the second externalelectronic device. However, it is not limited thereto.

The processor 120 may execute operation 1104 on condition that the firstdata or the second data is associated with the multimedia content, andmay execute operation 1106 on condition that the first data and thesecond data are not associated with the multimedia content.

In operation 1104, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event at least partiallyoverlapping at least part of the first CIS event, based on identifyingthat the first data or the second data is associated with the multimediacontent. For example, the processor 120 may obtain the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement.

In operation 1106, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event either in the sequentialarrangement or in the interleaved arrangement, based on identifying thatthe first data and the second data are not associated with themultimedia content. For example, when the sizes of the first data andthe second data are relatively small, the processor 120 may obtain theCIG event in the sequential arrangement or in the interleavedarrangement.

FIG. 12 is a flowchart illustrating a method of obtaining the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement, based on the quality of a link between the first externalelectronic device and the electronic device, according to an embodimentof the disclosure. This method may be executed by the electronic device101 illustrated in FIG. 1 , the electronic device 101 illustrated inFIG. 2 , the electronic device 101 illustrated in FIG. 3 , or theprocessor 120 of the electronic device 101.

Operations 1202 to 1204 of FIG. 12 may be associated with operation 802of FIG. 8 .

Referring to FIG. 12 , in operation 1202, the processor 120 may identifywhether the quality of the link between the first external electronicdevice and the electronic device 101 (or the quality of the link betweenthe second external electronic device and the electronic device 101) isequal to or greater than a reference quality. For example, when thequality of the link between the first external electronic device and theelectronic device 101 is below the reference quality, it may mean thatthe number of times of transmitting data through the second CIS eventoverlapping at least part of the first CIS event is limited, so theprocessor 120 may identify whether the quality of the link between thefirst external electronic device and the electronic device 101 is equalto or greater than the reference quality. The processor 120 may executeoperation 1204 on condition that the quality of the link between thefirst external electronic device and the electronic device 101 is equalto or higher than the reference quality, and may execute operation 1206on condition that the quality of the link between the first externalelectronic device 101 and the electronic device 101 is below thereference quality.

In operation 1204, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event at least partiallyoverlapping at least part of the first CIS event, based on identifyingthat the quality of the link between the first external electronicdevice and the electronic device 101 is equal to or greater than thereference quality. For example, the processor 120 may obtain the CIGevent including the first CIS event and the second CIS event in thehybrid arrangement.

In operation 1206, the processor 120 may obtain the CIG event includingthe first CIS event and the second CIS event in the sequentialarrangement or in the interleaved arrangement, based on identifying thatthe quality of the link between the first external electronic device andelectronic device 101 is below the reference quality.

As described above, the electronic device 101 may obtain the CIG eventincluding the first CIS event and the second CIS event in the hybridarrangement, based on identifying that the quality of the link betweenthe first external electronic device and the electronic device 101 isequal to or greater than the reference quality, in order to uniformlydistribute the time resources used for transmission from the electronicdevice 101 to the first external electronic device and the timeresources used for transmission from the electronic device 101 to thesecond external electronic device.

FIG. 13 is a flowchart illustrating a method of allocating an initialCIS event in the CIG event according to an embodiment of the disclosure.This method may be executed by the electronic device 101 illustrated inFIG. 1 , the electronic device 101 illustrated in FIG. 2 , theelectronic device 101 illustrated in FIG. 3 , or the processor 120 ofthe electronic device 101.

Referring to FIG. 13 , in operation 1302, the processor 120 may obtainthe CIG event including the first CIS event and the second CIS eventpartially overlapping part of the first CIS event. For example, thefirst CIS event may be a CIS event that occurs before the second CISevent in the CIG event.

In operation 1304, the processor 120 may obtain a next CIG eventimmediately after the CIG event, in which the second CIS event partiallyoverlapping part of the first CIS event occurs before the first CISevent. For example, when an anchor point of the CIG event obtained inoperation 1302 is an anchor point of the first CIS event, the processor120 may schedule the anchor point of the next CIG event obtained inoperation 1304 as an anchor point of the second CIS event, in order touniformly distribute the time resources allocated for the first CISevent and the time resources allocated for the second CIS event. Whenthe initial CIS event of the CIG event is the first CIS event, theprocessor 120 may set the initial CIS event of the next CIG event as thesecond CIS event.

As described above, the electronic device 101 can make a uniformdistribution of different CIS events by scheduling the initial CIS eventof k-th CIG event and the initial CIS event of (k+1)th CIG eventimmediately after the k-th CIG event, as the different CIS events.

FIG. 14 is a flowchart illustrating a method of allocating the initialCIS event in the CIG event based on the quality of the first linkbetween the first external electronic device and the electronic deviceand the quality of the second link between the second externalelectronic device and the electronic device according to an embodimentof the disclosure. This method may be executed by the electronic device101 illustrated in FIG. 1 , the electronic device 101 illustrated inFIG. 2 , the electronic device 101 illustrated in FIG. 3 , or theprocessor 120 of the electronic device 101.

Referring to FIG. 14 , in operation 1402, the processor 120 may identifywhether a value indicating the quality of the first link between thefirst external electronic device and the electronic device 101 is equalto or greater than a value indicating the quality of the second linkbetween the second external electronic device and the electronic device101. For example, the processor 120 may identify whether the valueindicating the quality of the first link is equal to or greater than thevalue indicating the quality of the second link, in order to furthersecure the time resources for transmission through the second link whenthe quality of the first link is better than the quality of the secondlink, and further secure the time resources for transmission through thefirst link when the quality of the second link is better than thequality of the first link. The processor 120 may execute operation 1404on condition that the value indicating the quality of the first link isequal to or greater than the value indicating the quality of the secondlink, and execute operation 1406 on condition that the value indicatingthe quality of the first link is less than the value indicating thequality of the second link.

In operation 1404, the processor 120 may set an anchor point of the CISevent (e.g., the first CIS event) for the first external electronicdevice as an anchor point of the next CIG event, based on identifyingthat the value indicating the quality of the first link is equal to orgreater than the value indicating the quality of the second link. Forexample, in order to further secure the time resources for transmissionthrough the second link (e.g., transmission through the second CISevent), the processor 120 may set the initial CIS event of the next CIGevent as the first CIS event.

In operation 1406, the processor 120 may set an anchor point of the CISevent (e.g., the second CIS event) for the second external electronicdevice as an anchor point of the next CIG event, based on identifyingthat the value indicating the quality of the first link is less than thevalue indicating the quality of the second link. For example, in orderto further the secure time resources for transmission through the firstlink (e.g., transmission through the first CIS event), the processor 120may set the initial CIS event of the next CIG event as the second CISevent.

As described above, by identifying the CIS event having a better linkquality from the first CIS event and the second CIS event, and settingthe identified CIS event as an initial event of the CIG event, theelectronic device 101 may complete transmission of data through theidentified CIS event before the end of the CIS event and transmit datathrough another CIS event. In other words, the electronic device 101 maycontrol transmissions via the CIG event including the first CIS eventand the second CIS event in the hybrid deployment depending on the stateof the links, thereby distributing the time resources for datatransmission according to the quality of each of the links.

According to various embodiments of the disclosure, as opposed to theillustration of FIG. 14 , the processor 120 may execute operation 1406on condition that in operation 1402, the value indicating the quality ofthe first link is equal to or greater than the value indicating thequality of the second link, and execute operation 1404 on condition thatthe value indicating the quality of the first link is less than thevalue indicating the quality of the second link.

FIG. 15 is a flowchart illustrating a method of transmitting packetsthrough the CIG event having the hybrid arrangement according to anembodiment of the disclosure. This method may be executed by theelectronic device 101 illustrated in FIG. 1 , the electronic device 101illustrated in FIG. 2 , the electronic device 101 illustrated in FIG. 3, or the processor 120 of the electronic device 101.

Referring to FIG. 15 , in operation 1502, the processor 120 may transmita first packet, which is the last packet of at least one target packetallocated to transmit to the first external electronic device in thefirst CIS event in the CIG event in hybrid arrangement, to the firstexternal electronic device, through the second sub-event before thefirst sub-event, the second sub-event ending the first CIS event. Forexample, the second sub-event may be a sub-event overlapping one ofsub-events in the second CIS event in the CIG event.

In operation 1504, the processor 120 may receive a signal from the firstexternal electronic device through the second sub-event in the first CISevent. For example, the signal may be a response packet to the firstpacket. For example, the signal may be an acknowledgement signal or anon-acknowledgement signal.

In operation 1506, the processor 120 may identify whether the signal isthe acknowledgement signal. For example, the processor 120 may identifywhether the signal is the acknowledgement signal or thenon-acknowledgement signal through an SN in the response packet. Theprocessor 120 may execute operation 1508 on condition that the signal isthe acknowledgement signal, and execute operation 1510 on condition thatthe signal is the non-acknowledgement signal.

In operation 1508, the processor 120 may transmit a second packet to thesecond external electronic device through one of the sub-events in thesecond CIS event, in response to identifying that the signal is theacknowledgement signal. For example, when the signal is theacknowledgement signal, it may mean that the transmission scheduled forthe first CIS event is completed before the end of the first CIS event,so the processor 120 may transmit the second packet to the secondexternal electronic device through the sub-event.

In operation 1510, in response to identifying that the signal is thenon-acknowledgement signal, the processor 120 may re-transmit the firstpacket to the first external electronic device through the firstsub-event after the second sub-event or a third sub-event immediatelyafter the second sub-event. For example, when the signal is thenon-acknowledgement signal, the processor 120 may re-transmit the firstpacket to complete the transmission scheduled for the first CIS event.

According to an embodiment of the disclosure, the electronic device,method, and computer-readable storage medium can provide a robustservice against the change in quality of at least one of a link betweenthe electronic device and the first external electronic device or a linkbetween the electronic device and the second external electronic device,by communicating with each of the first external electronic device andthe second external electronic device via a connected isochronous group(CIG) event that includes a first connected isochronous stream (CIS)event including first sub-events and a second CIS event including secondsub-events at least partially overlapping at least part of the firstsub-events.

As described above, according to an embodiment of the disclosure, anelectronic device (e.g., an electronic device 101) may comprisecommunication circuitry (e.g., a communication circuitry 190) forBluetooth low energy (BLE); at least one memory (e.g., a memory 130)configured to store instructions; and at least one processor (e.g., aprocessor 120) operably coupled with the communication circuitry and theat least one memory, the at least one processor being configured, whenexecuting the instructions, to obtain a connected isochronous group(CIG) event including a first connected isochronous stream (CIS) eventincluding first sub-events and a second CIS event including secondsub-events that are at least partially overlapped with at least part ofthe first sub-events; and based on receiving an acknowledgement (ACK)signal on first data transmitted to a first external electronic devicevia a first sub-event among the first sub-events, transmit second datato a second external electronic device via a third sub-event among thesecond sub-events overlapping a second sub-event immediately after thefirst sub-event among the first sub-events.

The at least one processor, when executing the instructions, may beconfigured to obtain, based on identifying that an anchor point of eachof the first sub events is synchronized with an anchor point of each ofthe second sub events, the CIG event including the first CIS eventincluding the first sub-events and the second CIS event including thesecond sub-events at least partially overlapping at least part of thefirst sub-events. The at least one processor, when executing theinstructions, may be further configured to obtain, based on identifyingthat the anchor point of each of the first sub events is notsynchronized with the anchor point of each of the second sub events, theCIG event including the first CIS event and the second CIS event in thesequential arrangement or the CIG event including the first CIS eventand the second CIS event in the interleaved arrangement.

The at least one processor, when executing the instructions, may befurther configured to obtain, based on identifying that a length of eachof the first sub events is identical to a length of each of the secondsub events, the CIG event including the first CIS event including thefirst sub-events and the second CIS event including the secondsub-events at least partially overlapping at least part of the firstsub-events. The at least one processor, when executing the instructions,may be further configured to obtain, based on identifying that thelength of each of the first sub-events is different from the length ofeach of the second sub-events, the CIG event including the first CISevent and the second CIS event in the sequential arrangement or the CIGevent including the first CIS event and the second CIS event in theinterleaved arrangement.

The at least one processor, when executing the instructions, may beconfigured to obtain the CIG event, by configuring an anchor point ofthe second CIS event within the first CIS event initiated from an anchorpoint of the first CIS event, the CIG event including the first CISevent including the first sub-events and the second CIS event includingthe second sub-events at least partially overlapping at least part ofthe first sub-events.

The at least one processor, when executing the instructions, may beconfigured to transmit, based on receiving from the first externalelectronic device via the first sub-event the acknowledgement signal onthe first data that is the last target data transmitted to the firstexternal electronic device via the first CIS event, the second data tothe second external electronic device via the third sub-event among thesecond sub-events.

The third sub-event overlapping the second sub-event may be a sub-eventthat initiates the second CIS event. A part of the second sub-events maynot overlap all of the first sub-events.

The at least one processor, when executing the instructions, may beconfigured to obtain, based on receiving capability information of thefirst external electronic device from the first external electronicdevice and receiving capability information of the second externalelectronic device from the second external electronic device, the CIGevent including the first CIS event including the first sub-events andthe second CIS event including the second sub-events at least partiallyoverlapping the at least part of the first sub-events.

The at least one processor, when executing the instructions, may beconfigured to obtain, based on identifying that the first data or thesecond data is associated with a multimedia content, the CIG eventincluding the first CIS event including the first sub-events and thesecond CIS event including the second sub-events at least partiallyoverlapping the at least part of the first sub-events.

The at least one processor, when executing the instructions, may beconfigured to obtain, based on identifying that the quality of a linkbetween the first external electronic device and the electronic deviceis equal to or more than a reference quality, the CIG event includingthe first CIS event including the first sub-events and the second CISevent including the second sub-events at least partially overlapping theat least part of the first sub-events.

The first CIS event may be allocated for the first external electronicdevice, the second CIS event may be allocated for the second externalelectronic device, an anchor point of the first CIS event among theanchor point of the first CIS event and the anchor point of the secondCIS event may be an anchor point of the CIG event, and the at least oneprocessor, when executing the instructions, may be further configured toobtain another CIG event next to the CIG event, wherein the other CIGevent may include a third CIS event and a fourth CIS event, the thirdCIS event including third sub events and being allocated for the firstexternal electronic device, the fourth CIS event including fourth subevents at least partially overlapped with at least part of the third subevents and being allocated for the second external electronic device,and wherein an anchor point of the fourth CIS event among an anchorpoint of the third CIS event and the anchor point of the fourth CISevent is an anchor point of the other CIG event.

The at least one processor, when executing the instructions, may beconfigured to, based on receiving the acknowledgement signal via thefirst sub-event, cease transmitting data to the first externalelectronic device via all of the remaining sub-events in the first CISevent.

The first sub-event may be a sub-event not overlapping with the secondsub-events, and a priority of a first service provided through the firstdata may be higher than a priority of second service provided with thesecond data.

As described above, a method for operating an electronic device with acommunication circuitry for Bluetooth low energy (BLE) according to anembodiment of the disclosure may comprise obtaining a connectedisochronous group (CIG) event including a first connected isochronousstream (CIS) event that includes first sub events and a second CIS eventthat includes second sub events that are at least partially overlappedwith at least part of the first sub events; and transmitting, based onreceiving an acknowledgement (ACK) signal for first data transmitted toa first external electronic device via a first sub event among the firstsub events, second data to a second external electronic device via athird sub event among the second sub events, the third sub event beingoverlapped with a second sub event immediately after the first sub eventamong the first sub events.

non-transitory computer-readable storage medium according to anembodiment of the disclosure, may store one or more programs includinginstructions that, when executed by at least one processor of anelectronic device with a communication circuitry for Bluetooth lowenergy, cause the electronic device to obtain a connected isochronousgroup (CIG) event including a first connected isochronous stream (CIS)event that includes first sub events and a second CIS event thatincludes second sub events that are at least partially overlapped withat least part of the first sub events; and transmit, based on receivingan acknowledgement (ACK) signal for first data transmitted to a firstexternal electronic device via a first sub event among the first subevents, second data to a second external electronic device via a thirdsub event among the second sub events, the third sub event beingoverlapped with a second sub event immediately after the first sub eventamong the first sub events.

An electronic device according to an embodiment of the disclosure maycomprise a communication circuit for Bluetooth low energy (BLE), and aprocessor, wherein the processor is configured to transmit, to a firstexternal electronic device, a first packet that is the last packet fromat least one target packet allocated for transmitting to the firstexternal electronic device within a first connected isochronous stream(CIS) event in a connected isochronous group (CIG) event, via a secondsub event before a first sub event ending the first CIS event; transmit,in response to receiving an acknowledgement (ACK) signal for the firstpacket via the second sub event from the first external electronicdevice, a second packet to a second external electronic device via a subevent among sub events in a second CIS event in the CIG event; andre-transmit, in response to a non-acknowledgement (NACK) signal for thefirst packet via the second sub event from the first external electronicdevice, the first packet to the first external electronic device via asub event immediately after the second sub event among the remaining subevents in the first CIS event.

According to an embodiment of the disclosure, a method for operating anelectronic device with a communication circuitry for Bluetooth lowenergy (BLE) may comprise transmitting, to a first external electronicdevice, a first packet that is the last packet from at least one targetpacket allocated for transmitting to the first external electronicdevice within a first connected isochronous stream (CIS) event in aconnected isochronous group (CIG) event, via a second sub event before afirst sub event ending the first CIS event; transmitting, in response toreceiving an acknowledgement (ACK) signal for the first packet via thesecond sub event from the first external electronic device, a secondpacket to a second external electronic device via a sub event among subevents in a second CIS event in the CIG event; and re-transmitting, inresponse to a non-acknowledgement (NACK) signal for the first packet viathe second sub event from the first external electronic device, thefirst packet to the first external electronic device via a sub eventimmediately after the second sub event among the remaining sub events inthe first CIS event.

According to an embodiment of the disclosure, a non-transitorycomputer-readable storage medium may store one or more programsincluding instructions that, when executed by at least one processor ofan electronic device with a communication circuitry for a BLE, cause theelectronic device to transmit, to a first external electronic device, afirst packet that is the last packet from at least one target packetallocated for transmitting to the first external electronic devicewithin a first connected isochronous stream (CIS) event in a connectedisochronous group (CIG) event, via a second sub event before a first subevent ending the first CIS event; transmit, in response to receiving anacknowledgement (ACK) signal for the first packet via the second subevent from the first external electronic device, a second packet to asecond external electronic device via a sub event among sub events in asecond CIS event in the CIG event; and re-transmit, in response to anon-acknowledgement (NACK) signal for the first packet via the secondsub event from the first external electronic device, the first packet tothe first external electronic device via a sub event immediately afterthe second sub event among the remaining sub events in the first CISevent.

The electronic device according to various embodiments disclosed hereinmay be one of various types of electronic devices. The electronicdevices may include, for example, a portable communication device (e.g.,a smartphone), a computer device, a portable multimedia device, aportable medical device, a camera, a wearable device, or a homeappliance. The electronic devices are not limited to those describedabove.

It should be appreciated that various embodiments of the disclosure andthe terms used therein are not intended to limit the technologicalfeatures set forth herein to particular embodiments and include variouschanges, equivalents, or replacements for a corresponding embodiment.With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements. As usedherein, each of such phrases as “A or B,” “at least one of A and B,” “atleast one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and“at least one of A, B, or C,” may include any one of, or all possiblecombinations of the items enumerated together in a corresponding one ofthe phrases. As used herein, such terms as “1st” and “2nd,” or “first”and “second” may be used to simply distinguish a corresponding componentfrom another, and does not limit the components in other aspect (e.g.,importance or order). It is to be understood that if an element (e.g., afirst element) is referred to, with or without the term “operatively” or“communicatively,” as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

As used in connection with various embodiments of the disclosure, theterm “module” may include a unit implemented in hardware, software, orfirmware, and may be interchangeably used with other terms, for example,“logic,” “logic block,” “part,” or “circuitry.” A module may be a singleintegral component, or a minimum unit or part thereof, adapted toperform one or more functions. For example, according to an embodimentof the disclosure, the module may be implemented in a form of anapplication-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., an internal memory 136 or an externalmemory 138) that is readable by a machine (e.g., the electronic device101). For example, a processor (e.g., the processor 120) of the machine(e.g., the electronic device 101) may invoke at least one of the one ormore instructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. The term“non-transitory” simply means that the storage medium is a tangibledevice, and does not include a signal (e.g., an electromagnetic wave),but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment of the disclosure, a method according tovarious embodiments of the disclosure may be included and provided in acomputer program product. The computer program product may be traded asa product between a seller and a buyer. The computer program product maybe distributed in the form of a machine-readable storage medium (e.g., acompact disc read only memory (CD-ROM)), or be distributed (e.g.,downloaded or uploaded) online via an application store (e.g.,PlayStore™), or between two user devices (e.g., smart phones) directly.If distributed online, at least part of the computer program product maybe temporarily generated or at least temporarily stored in themachine-readable storage medium, such as memory of the manufacturer'sserver, a server of the application store, or a relay server.

According to various embodiments of the disclosure, each component(e.g., a module or a program) of the above-described components mayinclude a single entity or multiple entities, and some of the multipleentities may be separately disposed in different components. Accordingto various embodiments of the disclosure, one or more of theabove-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments of thedisclosure, the integrated component may still perform one or morefunctions of each of the plurality of components in the same or similarmanner as they are performed by a corresponding one of the plurality ofcomponents before the integration. According to various embodiments ofthe disclosure, operations performed by the module, the program, oranother component may be carried out sequentially, in parallel,repeatedly, or heuristically, or one or more of the operations may beexecuted in a different order or omitted, or one or more otheroperations may be added.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a communicationcircuitry for Bluetooth low energy (BLE); and a processor configured to:obtain a connected isochronous group (CIG) event including a firstconnected isochronous stream (CIS) event that includes first sub-eventsand a second CIS event that includes second sub-events that at leastpartially overlap at least part of the first sub-events, and transmit,based on receiving an acknowledgement (ACK) signal for first datatransmitted to a first external electronic device via a first sub-eventamong the first sub-events, second data to a second external electronicdevice via a third sub-event among the second sub-events, wherein thethird sub-event overlaps a second sub-event immediately after the firstsub-event among the first sub-events.
 2. The electronic device of claim1, wherein the processor is further configured to obtain the CIG eventbased on identifying that an anchor point of each of the firstsub-events is synchronized with an anchor point of each of the secondsub-events.
 3. The electronic device of claim 2, wherein the processoris further configured to obtain, based on identifying that the anchorpoint of each of the first sub-events is not synchronized with theanchor point of each of the second sub-events, the CIG event includingthe first CIS event and the second CIS event in sequential arrangementor the CIG event including the first CIS event and the second CIS eventin interleaved arrangement.
 4. The electronic device of claim 1, whereinthe processor is further configured to obtain the CIG event byconfiguring an anchor point of the second CIS event within the first CISevent initiated from an anchor point of the first CIS event.
 5. Theelectronic device of claim 1, wherein the processor is furtherconfigured to transmit, based on receiving from the first externalelectronic device via the first sub-event, the ACK signal for the firstdata that is a last target data transmitted to the first externalelectronic device via the first CIS event, the second data to the secondexternal electronic device via the third sub-event among the secondsub-events.
 6. The electronic device of claim 1, wherein the thirdsub-event that overlaps the second sub-event is a sub-event initiatingthe second CIS event.
 7. The electronic device of claim 6, wherein atleast a portion of the second sub-events does not overlap any of thefirst sub-events.
 8. The electronic device of claim 1, wherein theprocessor is further configured to obtain the CIG event based onreceiving capability information of the first external electronic devicefrom the first external electronic device and receiving capabilityinformation of the second external electronic device from the secondexternal electronic device.
 9. The electronic device of claim 1, whereinthe processor is further configured to obtain the CIG event based onidentifying that the first data or the second data is associated with amultimedia content.
 10. The electronic device of claim 1, wherein theprocessor is further configured to obtain the CIG event based onidentifying that quality of a link between the first external electronicdevice and the electronic device is above reference quality.
 11. Theelectronic device of claim 1, wherein the first CIS event is allocatedfor the first external electronic device, wherein the second CIS eventis allocated for the second external electronic device, wherein ananchor point of the first CIS event among the anchor point of the firstCIS event and an anchor point of the second CIS event is an anchor pointof the CIG event, wherein the processor is further configured to obtainanother CIG event next to the CIG event, wherein the other CIG eventincludes a third CIS event and a fourth CIS event, wherein the third CISevent includes third sub-events and is allocated for the first externalelectronic device, wherein the fourth CIS event includes fourthsub-events at least partially overlapped with at least part of the thirdsub-events and is allocated for the second external electronic device,and wherein an anchor point of the fourth CIS event among an anchorpoint of the third CIS event and the anchor point of the fourth CISevent is an anchor point of the other CIG event.
 12. The electronicdevice of claim 1, wherein the processor is further configured to cease,based on receiving the ACK signal via the first sub-event, to transmitdata to the first external electronic device via all of remainingsub-events in the first CIS event.
 13. The electronic device of claim 1,wherein the first sub-event is a sub-event not overlapped with thesecond sub-events, and wherein priority of a first service providedthrough the first data is higher than priority of a second serviceprovided through the second data.
 14. A method for operating anelectronic device with a communication circuitry for Bluetooth lowenergy (BLE), the method comprising: obtaining a connected isochronousgroup (CIG) event including a first connected isochronous stream (CIS)event that includes first sub-events and a second CIS event thatincludes second sub-events that at least partially overlap at least partof the first sub-events; and transmitting, based on receiving anacknowledgement (ACK) signal for first data transmitted to a firstexternal electronic device via a first sub-event among the firstsub-events, second data to a second external electronic device via athird sub-event among the second sub-events, wherein the third sub-eventoverlaps a second sub-event immediately after the first sub-event amongthe first sub-events.
 15. The method of claim 14, wherein the obtainingof the CIG event comprises obtaining the CIG event based on identifyingthat an anchor point of each of the first sub-events is synchronizedwith an anchor point of each of the second sub-events.
 16. The method ofclaim 15, further comprising: obtaining, based on identifying that theanchor point of each of the first sub-events is not synchronized withthe anchor point of each of the second sub-events, the CIG eventincluding the first CIS event and the second CIS event in sequentialarrangement or the CIG event including the first CIS event and thesecond CIS event in interleaved arrangement.
 17. The method of claim 14,wherein the obtaining of the CIG event comprises obtaining, byconfiguring an anchor point of the second CIS event within the first CISevent initiated from an anchor point of the first CIS event, the CIGevent.
 18. The method of claim 14, wherein the transmitting of thesecond data comprises transmitting, based on receiving from the firstexternal electronic device via the first sub-event, the ACK signal forthe first data that is a last target data transmitted to the firstexternal electronic device via the first CIS event, the second data tothe second external electronic device via the third sub-event among thesecond sub-events.
 19. The method of claim 14, wherein the thirdsub-event that overlaps the second sub-event is a sub-event initiatingthe second CIS event.
 20. An electronic device comprising: acommunication circuitry for Bluetooth low energy (BLE); and a processorconfigured to: transmit, to a first external electronic device, a firstpacket that is a last packet from at least one target packet allocatedfor transmitting to the first external electronic device within a firstconnected isochronous stream (CIS) event in a connected isochronousgroup (CIG) event, via a second sub-event before a first sub-eventending the first CIS event, transmit, in response to receiving anacknowledgement (ACK) signal for the first packet via the secondsub-event from the first external electronic device, a second packet toa second external electronic device via a sub-event among sub-events ina second CIS event in the CIG event, and re-transmit, in response to anon-acknowledgement (NACK) signal for the first packet via the secondsub-event from the first external electronic device, the first packet tothe first external electronic device via a sub-event immediately afterthe second sub-event among remaining sub-events in the first CIS event.